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Photonic-electronic Panels Integration | Drexault

Home ContractsPhotonic-electronic Panels Integration

DARPA / Microsystems Technology

Photonic-electronic Panels Integration

DPA26BZ01-NV002STTRBAADARPA

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Description

Develop and demonstrate a prototype for photonic-electronic panel technology for the integration of photonic chips (PICs) that contain high-density three-dimensional chip-to-chip and intra-chip optical routing technology developed by the DARPA Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) program. | Acronym: PEPI | Tech Office: Microsystems Technology | Topic #: DPA26BZ01-NV002 | Announcement: STTR

Details

Type: STTR
Deadline: Jun 3, 2026
Source: DARPA
First Seen: Apr 15, 2026

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