Photonic-Integrated Circuit (PIC) Component Fabrication for AstroPIC High-Contrast Imaging Request for Information (RFI)

The National Aeronautics and Space Administration (NASA) Ames Research Center (ARC) is hereby soliciting information from potential sources for requirements related to the photonic-integrated circuit (PIC) component fabrication for AstroPIC: Photonic Integrated Circuit High-Contrast Imaging. PIC component fabrication: The successful contractor will be responsible for the component fabrication of a PIC with requirements set to enable a coronagraphic photonic nulling capability. This task includes fabrication of a PIC component at a commercial photonics foundry. PIC component inspection: Characterization of the photonic component to ensure the PIC component is properly post-processed, packaged, and verified for delivery on the printed circuit board (PCB). System performance testing: After manufacture of the photonic chip component, the system will undergo performance testing to demonstrate photonic nulling, throughput, bandwidth, and working angle separations. As part of this market research, we are seeking the following: (1) list of photonic integrated circuit wafer sizes, (2) substrates options (e.g., Silicon, Silicon Nitride, Lithium Niobate, Glass, etc.), (3) estimated time to component delivery after receiving design (i.e., foundry run-time), (4) estimated costs, and (5) access to foundry design kits to enable providing a photonic integrated circuit design. NASA ARC is seeking capability statements from all interested parties, including all socioeconomic categories of Small Businesses and Historically Black Colleges and Universities (HBCU)/Minority Institutions (MI), and members of the underserved communities as defined by Executive Order 13985, Advancing Racial Equity And Support For Underserved Communities Through The Federal Government, for the purposes of determining the appropriate level of competition and/or small business subcontracting goals for component fabrication for AstroPIC: Photonic Integrated Circuit High-Contrast Imaging. The Government reserves the right to consider a Small, 8(a), Women-owned (WOSB), Service-Disabled Veteran (SD-VOSB), Economically Disadvantaged Women-owned Small Business (EDWOSB) or HUBZone business set-aside based on responses received. No solicitation exists; therefore, do not request a copy of the solicitation. If a solicitation is released, it will be synopsized on SAM.gov. Interested firms are responsible for monitoring this website for the release of any solicitation or synopsis. Vendors having the capabilities necessary to meet or exceed the stated requirements are invited to submit appropriate documentation, literature, brochures, and references. Potential vendors with experience in mirror coating chamber installation and testing are invited to provide information on their capabilities, including: Company profile and experience with similar projects Approach to the installation, reassembly, and performance testing phases Demonstrated ability to comply with detailed engineering specifications and safety protocols Availability and projected timelines for undertaking the project Any specific requirements or support needed from NASA ARC All responses shall be submitted electronically via email to Rosalinda R. De Leon at [email protected] no later than March 8, 2024, by 12:00 PM Central Time. Please reference “AstroPIC: PIC Component Fabrication” in any response. This synopsis is for information and planning purposes only and is not to be construed as a commitment by the Government nor will the Government pay for information solicited. Respondents will not be notified of the results of the evaluation.