N00164-17-S-NB46 - REQUEST FOR INFORMATION (RFI) - XENON DIFLUORIDE ETCH TOOL - FSC 6640 - NAICS 333242 Issue Date: 22 FEBRUARY 2017 - Closing Date: 24 MARCH 2017 - 2:00 PM EDT I. Request for Information: The Government is issuing this RFI as part of a market survey in accordance with FAR 15.201(e) to determine the availability of sources to provide a xenon difluoride etch tool at the Naval Surface Warfare Center (NSWC) Crane, IN. This RFI is published to obtain information for use by NSWC Crane Division, for market research and planning purposes only; and is not a Request for Proposal, Invitation for Bid, or an announcement of a solicitation. There is no bid package or solicitation document associated with this announcement. This RFI is part of a continuous process for obtaining the latest information on the commercial status of the industry with respect to current and near-term abilities. Response to this RFI is strictly voluntary and will not affect any potential offeror's ability to submit an offer if a solicitation is released. No entitlement to payment of direct or indirect costs or charges by the Government will arise as a result of preparing submissions in response to this RFI and the Government's use of such information. The scope of this effort is as follows: The purpose of this requirement is to obtain a table top Xenon Difluoride (XeF) etch tool. The system shall include the following: 1. Xenon Difluoride Etch Base System a. Table Top Cabinet, 110/120 VAC single phase b. Incorporated 64 bit PC with application software & removable disc drive c. Expansion Chamber capable of etching small devices d. Transparent chamber lid for clear monitoring e. Source Capacity of 300cc or up to 600g of XeF2 f. Vacuum pump compatible with XeF g. Safety interlocks & Emergency power switch h. System operation manual i. 1 year warranty to include software updates & phone support 2. Microscope with integrated camera: a. Minimum/Maximum: approximately 5x - 60x magnification b. Stereo Microscope c. Microscope stand d. Fiber Optic Ring illuminator e. High Intensity Light Source f. Fully interfaced camera system with exposure control g. Separate 64bit PC with imaging software 3. Heated Chamber: a. Heated expansion chamber b. Heated process chamber c. Temperature controllers d. Temperature measurement capabilities e. Temperature set points & display software 4. Pulsed & Continuous Flow a. Pulsed & Continuous flow of XeF2 b. Recipe creation & process control c. Automatic pressure controller 5. System Installation and Training: a. Onsite system installation b. Onsite operators and applications training Information may be submitted by any government or non-government entity including commercial firms, non-profit organizations, and any institutions of higher education with degree-granting programs in science and /or engineering (universities), or by consortia compromising such concerns. The Crane Division encourages participation by small business, small disadvantaged business, HUB zone small business, woman-owned small business, veteran-owned small business, and historically black colleges and universities. The Government may choose to visit, or host a visit from, any potential sources. This request for information/sources sought synopsis in no way implies either implicitly or explicitly that respondents will be compensated in any way by the Government for information provided. II. BACKGROUND: The Failure & Material Analysis Branch, Code GXMS, at NSWC Crane supports the evaluation of component testing during development, qualification and production phases. They perform failure and material analysis of electronic components, semiconductor devices, printed wiring boards, assemblies and systems. They also perform vendor product surveillance which includes part/material characterization, production process monitoring/evaluation and service life evaluation & aging studies. Failure analysis performed at transistor, die, board & equipment level. The xenon difluoride etching tool is a tool to dry etch silicon from semiconductor devices. This method of etching will be used as an alternative to wet chemical etching and mechanical material removal which can both damage sensitive areas on both backside and topside levels of the semiconductor. This type of tool is highly selective and controlled giving added capabilities with higher success rates. III. Responses shall be: 1) Responses are requested by 1400/2:00PM Eastern Standard Time (EST) on 24 March 2017. Any response received after this date will also be considered but may not be included in initial reporting or assessments. 2) All responses should be given in PDF format and emailed to the contracting point of contract: Ms. Lorna Tribby at
[email protected]. The subject line of the email should include the RFI number (N00164-17-S-NB46) and the respondent's name. If necessary, files too large for email can be sent via CD by the same response date to: Ms. Lorna Tribby Naval Surface Warfare Center, Crane Division 300 HWY 361, BLD 121 Crane, IN 47522 3) Responses should not exceed six (6) pages and should be typed in 12-point Times New Roman font, single spaced with 1-inch margins. All information received in response to this RFI that is marked proprietary will be handled accordingly. 4) A suggested submission organization: a) A cover letter (optional). b) A cover page identifying the RFI number (N00164-17-S-NB46), the company name, mailing address, email address, telephone and fax numbers, website address (if available), duns number, cage code and/or tax ID number, business size category (large, small, small disadvantaged, etc.), and the name, telephone number, and e-mail address of a point of contact having the authority and knowledge to clarify responses with Government representatives. c) No more than five (5) pages including: 1. Objective: Clear and concise statement of the manufacturing and / or design capabilities of your organization. 2. Describe the capabilities of your organization in detail. 3. Describe any history that meets the requirements. 4. Characteristics, specifications, and certifications your organization holds as related to the capabilities, interests/focus items above, to include the below as applicable: a. Identify your organizations experience with xenon difluoride etch tools. b. Identify your organization's refurbished products that are currently fielded and by whom. c. Intellectual property claims (if any). d. Explain how quality control is incorporated in your processes. e. Earliest availability for a technical demonstration at no cost or risk to the government. 5. Cost or pricing information to be used as Market Research for pricing history. Per Federal Acquisition Regulation (FAR) 52.215-3 Request for Information or Solicitation for Planning Purposes (Oct 1997): a) The Government does not intend to award a contract on the basis of this solicitation or to otherwise pay for the information solicited except as an allowable cost under other contracts as provided in subsection 31.205-18, Bid and proposal costs, of the Federal Acquisition Regulation. (b) Although "proposal" and "offeror" may be used in this Request for Information, your response will be treated as information only. It shall not be used as a proposal. All responses shall be unclassified. All assumptions, including any assumed Government support, shall be clearly identified. All proprietary and restricted information shall be clearly marked. All information marked as proprietary information will be safeguarded to prevent disclosures to non-government personnel and entities. Contractors must be properly registered in the Government System for Award Management database (SAM). Offerors may obtain information on SAM registration and annual confirmation requirements by calling 1-866-606-8220, or via the Internet at www.sam.gov. This request for information does not constitute an Invitation for Bids (IFB), a Request for Quote (RFQ) or a Request for Proposal (RFP) and it should not be construed as a commitment of any kind by the Government to issue a formal solicitation or ultimately award a contract. The US Government is in no way liable to pay for or reimburse any companies or entities that respond to this announcement. Any costs incurred by interested companies in response to this announcement will NOT be reimbursed. All information received in response to this notice that is marked proprietary will be handled accordingly. No contract will be awarded by issuing this RFI. Acknowledgement of receipt of responses will not be made, nor will respondents be notified of the NSWC Crane's view of the information received. Do not send any material that requires a non-disclosure agreement or identify information that is business sensitive. Responses to this notice will not be returned. Telephone calls/questions or inquiries will not be accepted. All information provided becomes U.S. Navy property and will not be returned. All proprietary information will be treated appropriately. Your interest in this response is appreciated. White papers may be submitted any time prior to expiration of this announcement. Electronic submissions and hard copy submissions will be reviewed if received by the closing date and time. All information marked as proprietary information will be safeguarded to prevent disclosures to non-governmental personnel and entities. Submissions regarding this announcement may be directed to the Contract Specialist, Ms. Lorna Tribby, telephone: 812-854-8761, e-mail:
[email protected]. The mailing address is: COMMANDER; ATTN MS LORNA TRIBBY BLDG 121; NAVSURFWARCENDIV; 300 HIGHWAY 361; CRANE, IN 47522-5001. Please reference: Request for Information/Sources Sought Announcement Number (N00164-17-S-NB46) when responding to this notice. The technical POC is Mr. Patrick Bruner, e-mail:
[email protected], telephone 812-854-5222