The U.S. Army, Army Contracting Command (ACC) New Jersey, Picatinny Arsenal, NJ 07806-5000, on behalf of the Armament, Research, Development and Engineering Center (ARDEC) is seeking firms capable of providing commercial off the shelf electronic devices to support manufacturing and testing, as well as design services for manufacturability, manufacturing and test services for similar items. Off the shelf items include, but are not limited to; Flip Chip, Direct Chip Attach & Chip on Board (COB), Area Array Packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror Ball Grid Array), Chip Scale Package (CSP) Assemblies, 0.3mm - 0.5mm Wafer Scale CSP (WLCSP) Assemblies, Lead-free Soldering, Optoelectronics Assembly & Packaging, High-Density Large Panel Assemblies, Die to Wafer 3D Assemblies, TSV Interposer Assemblies, Die and SMT onto silicon interposer Assemblies, Die and SMT onto flexible circuit Assemblies, Die and SMT onto rigid-flex Assemblies, System-in-Package Assemblies, MEMS Packaging, Gold Stud bump bonding for Flip Chip, Solder Balling and Replacement, Stacked IC Packaging, Flip Chip Packaging, Fluxless Reflow Soldering, Eutectic Die Bonding, Epoxy Die Bonding, Gold, Aluminum, and Copper Ball Bonding, Wedge Bonding, Ribbon Bonding, Chip to Chip Bonding, Re-workable and No-Flow Underfills, Flux-Underfill Qualification & Analysis, Adhesive Printing, Adhesive Dispensing and Jetting, HALT(Highly Accelerated Life Test) & HAST(Highly Accelerated Stress Test) Testing, Air-Air Thermal Cycle Testing, High Temperature Storage, Liquid-Liquid Thermal Shock Testing, and Temperature Humidity Testing Manufacturing and test services for selected commercial off the shelf items, including; Flux-Underfill Qualification & Analysis, Adhesive Printing, Adhesive Dispensing and Jetting, HALT & HAST testing, Air-Air Thermal Cycle testing, High Temperature Storage, Liquid-Liquid Thermal Shock testing, Temperature Humidity Testing, and 01005, 0201 through 55 mm BGA processing All interested and potential firms must be registered in CCR (http://www.ccr.gov), and current firms must update once a year to maintain active status. Firms/companies are invited to indicate their interests and capabilities by providing specifications, brochures, manuals, reports, information pertaining to experience on previous projects, specific work previously performed or being performed, any in-house research and development effort, and any other specific and pertinent information as pertains to this particular area of procurement that would enhance our consideration and evaluation of the information submitted. Responses shall also indicate the size of the business entity; large or small and provide your DUNS or Cage Code. Please provide the name of your firm, address, POC, phone/fax number, and email address. TELEPHONE INQUIRIES WILL NOT BE ACCEPTED. The Government will accept written questions by email only. Interested firms/companies are encouraged to submit their capabilities/qualification data NO LATER THAN September 7, 2012. The Point of Contact is Scott Dern, Contract Specialist,
[email protected] . This is a market survey for information only and shall not be construed as a request for a proposal or as an obligation on the part of the US Government. The US Government does not intend to award a contract on the basis of this market survey or otherwise pay for information solicited. The Government is not obligated to notify respondents of the results of this survey.