manual wire bonder

A manual wire bonder is required to prepare chip-based samples for electrical testing. This wire bonder will be used with a variety of samples incorporating a wide range of materials. As a result, a manual wire bonder is needed that can perform wedge, ball, and ribbon bonding. Technical Specifications: 1. The wire bonder shall be capable of wedge, ball, and ribbon wire bonding. A trained user must be able to reconfigure the wire bonder for each of these bonding modes within 5 minutes. 2. The wire bonder shall be capable of manual operation, where the X and Y positioning of the sample and Z position of the bonding tool are manually controlled by the user. 3. The wire specifications for the three modes are: a. Wedge bonding: gold or aluminum wire with a diameter between 25 μm and 75 μm. b. Ball bonding: gold wire with a diameter between 25 μm and 50 μm. c. Ribbon bonding: gold wire with a 20 μm thickness and width between 100 μm and 200 μm. 4. The ultrasonic frequency used for bonding shall be between 60 kHz and 70 kHz and the maximum ultrasonic power available shall be at least 5 W. 5. The bond time shall have a range that is at least between 20 ms and 1000 ms. 6. The bond force shall have a range that is at least between 0.15 N (15 grams) and 1.18 N (120 grams). 7. The wire bonder shall have a manual manipulator for controlling the X and Y positions of the sample. The range of the manipulator shall be at least 15 mm in each direction and there shall be a ratio between the motion of the manipulator and the motion of the sample of at least 6:1. The manual manipulator shall have buttons for feeding the wire in and out of the bonding tool. 8. The wire bonder shall have a lever for manually controlling the Z position of the bonding tool relative to the sample. The height difference between the first and second bonds shall be able to be at least 5 mm. 9. The wire bonder shall have a motorized clamping mechanism for holding the wire during bonding, feeding wire through the bonding tool, and setting the tail at the end of each bond. The clamping mechanism shall be able to swing out of the way when the clamp is open so that the user can get unobstructed access to the top of the bonding tool during the wire threading process. 10. The wire bonder in ball bonding mode shall use an electronic flame off (EFO) lever to generate the ball at the tip of the bonding wire. The height of the EFO lever relative to the bonding tool shall be adjustable. The EFO voltage shall be user adjustable between 0 V and the maximum voltage, where the maximum voltage must be capable of generating a mashed ball diameter that is at least 3 times larger than the wire diameter. 11. A stereo microscope shall be included and directly integrated into the wire bonder for direct observation of the bonding process. The microscope shall have a magnification range that includes 6X to 100X and the depth of field shall be at least 10 mm. Both the sample and bond tool shall be observable through the microscope to aid in the threading of the bond tool with wire. The microscope shall include an LED illumination system in which the angle of illumination relative to the sample can be adjusted through a +/-45° cone. 12. An adjustable-height heated work stage shall be included with the wire bonder. The work stage shall have a temperature range that includes 80° C to 200° C. A heater controller shall be included with the wire bonder to control the work stage temperature. The work stage shall be able to mount dual-in-line (DIP) packages with 0.3" and 0.6" row spacing and a length between 0.5" and 1.5", as well as square leadless chip carriers (LCC) with a width of 0.5" to 1". 13. The wire bonder shall have a single modern digital interface with soft keys and/or touchscreen for setting and displaying all of the bond parameters (ultrasound power, bond time, bond force, bond mode, work stage temperature, tail length). This interface shall be able to store up to 20 bonding programs that include all of the bonding parameters (see previous sentence). 14. The wire bonder shall include a bonding startup kit that includes: a. 2" spool of 25 μm diameter gold bonding wire, Quantity 1 b. 2" spool of 25 μm diameter aluminum bonding wire, Quantity 1 c. Wedge bonding tool for 25 μm diameter wire, Quantity 3 d. Ball bonding tool for 25 μm diameter wire, Quantity 3 15. Installation and a one-day (at least 4 hours) training session for six NIST researchers shall be provided. 16. The wire bonder shall have a volume that is smaller than 700 mm wide x 700 mm deep x 500 mm tall. 17. The wire bonder shall be powered by one single phase 120 V, 60 Hz, three prong electrical receptacle (standard U.S. receptacle).