Maintenance for Flip Chip Bonding Tool

NASA/NSSC has a requirement for preventative maintenance contract covering our FC150 Flip Chip Bonder. These systems contain proprietary software designed specifically for the equipment. NASA/NSSC intends to issue a sole source contract to JB TECHNICAL SUPPORT SERVICE 3020 E CLARENDON AVE PHOENIX ARIZONA 85016-7015 under the authority of FAR 13.106-1(b)(1)(i). The personnel performing this work must be appropriately trained on the specific systems, have availability of parts specific to the Goddard-owned equipment, access to proprietary schematics and software, as well as timeliness of the maintenance schedule. NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Goddard Space Flight Center (GSFC). The Government intends to acquire commercial items and services using the provisions, clauses and procedures prescribed in FAR Part 12 and FAR Part 13. The NAICS Code for this procurement is 541990. Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 12:00 p.m. Eastern Standard Time on April 28, 2021 . Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html . Primary Point of Contact: Kathi Thomas Procurement Specialist [email protected] Secondary Point of Contact: Tiffany Neal Contracting Officer [email protected]