NASA/MSFC has a requirement for the development of a Ground On Demand Manufacturing of Electronics (ODME) System. The primary objective for ODME is to fabricate a range of multimaterial on-demand printed electronics devices in microgravity on the International Space Station (ISS). To achieve that objective, a fabrication system is required that will utilize multiple materials and multiple fabrication processes to produce a wide range of on-demand electronics. This requirement includes the completion of fourteen (14) tasks that are focused on the process requirements for ODME in terms of adding, subtracting, and post processing of materials and ciruits. These fourteen (14) tasks are listed below: Task 1: Process Requirements (Process Apps): An evaluation of the processes needed to automatically manufacture a fully functional circuit shall be performed. The processes for manufacturing circuits include adding materials, subtracting materials, and several in situ processes such as smoothing and heating, as well. The processing shall be layer by layer to ensure that each layer is fully functional. Additionally, it will be necessary to electrically connect the layers and characterize each layer. Task 2: Enclosure: The enclosure shall be designed around the requirements given by the ISS quad locker specifications. The electrical and mechanical requirements should meet the maximum size and shape constraints to accommodate integration in the ISS. Task 3: Electronics: The ISS has restrictions and additional requirements for electronics to enhance safety. Task 4: XYZ Motion: This task shall include the development and verification of a precision 3D gantry motion system. Task 5: Tool Plate: The tool plate shall be mounted to the gantry motion system shall hold the heads and process devices. A requirement of this new system is the capability to include 8-10 different tools for multiple materials and processes. Task 6: Viewing: A process viewing camera is required on the tool head. The viewing camera shall have a high mag lens to allow the operator a close look at the deposition tip where the process is occurring. This camera shall provide the accuracy to calibrate each pen tip location to an accuracy of less than five (5) microns. Task 7: Vision: The vision camera shall include a downward looking digital camera or equivalent with a high mag lens and then using software to analyze contrast. All of this shall be performed with computer control and completely automated. Task 8: Z Scanner: Z height scanning shall be utilized to accurately scan a substrate surface and to determine the gap between the pen tip and the substrate. The Z height scanners shall also be used to post evaluate a print to detect defects. Task 9: Pick and Place: A pick and place capability shall be developed for precisely placing electronic components. This capability should provide for a wide range of active and passive electronic components and shall be designed to be easy to load and calibrate as needed. Task 10: Direct write extrusion head: The direct write extrusion head shall be reduced in size. This shall be accomplished without changing any of the current flow path or operation; the extrusion head shall be identical in performance to current direct write heads but shall be physically smaller. The new direct write extrusion head shall be a minimum of 25% smaller in size/volume that the current direct write extrusion head. Task 11: Laser: The laser shall be a dual purpose, pulsed, and CW laser. The pulsed laser is down to five (5) nanoseconds which is a safe laser and effective for trimming and drilling small holes. The CW portion shall be a minimum of thirty (30) watts of power which is adequate for heating and annealing localized areas. The laser shall be fiber coupled and direct down on the platform. The laser shall not operate unless the door is closed and sealed. Task 12: Micro-milling: The micro-mill shall include a vacuum with a directed hose at the point of removal and pulls the debris away and into a filter for collection. A report showing the level of material removed/filtered shall be provided with the system. This report shall include the particle sizes, composition, and amount of the particulate filtered by the system. Task 13: Integration: Each of the individual heads and processes shall be built and tested separately to confirm proper operation. Once each part is working, all parts shall be integrated into the enclosure. Wiring and mechanical assembly shall provide a secure and ruggedized fit. Task 14: Testing: Testing of the integrated system shall include the standard Post Assembly Test (PAT) routine that is performed on every tool. Once the system has passed all testing requirements, the system shall begin printing circuits to demonstrate the functional features of the system. NASA/MSFC intends to issue a sole source contract to acquire the items from Sciperio, Inc. (Sciperio) pursuant to the statutory authority permitting other than full and open competition of 10 U.S.C. 2304(c)(1), as implemented by FAR 6.302-1, “Only One Responsible Source and No Other Supplies or Services Will Satisfy Agency Requirements.” The Government does not intend to acquire a commercial item using FAR Part 12. Interested organizations may submit their capabilities and qualifications to perform the effort electronically via email to Laura Bullington at
[email protected] not later than 2:00 p.m. CST on December 01, 2021. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this acquisition on a competitive basis. A determination by the Government not to compete this acquisition on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the Government. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html